Description

THERMAL PASTE

thermal conductivity,

easy to assemble,

high stability,

does not harden with time.

Applications

Displays, lighting protection. PDP TV, LCD CCFL and LCD LED display backlight, LED signage, projectors and new display technology.

Consumer and industrial electronics

Mobile telephone, communication base station, laptop, notebook, computer servers, handheld gaming devices, memory modules, CPU modules, amplifiers, batteries, and DC to DC converter power supplies.

Automotive electronics

Engine management, electronic suspension, braking systems, communication and multimedia systems, comfort convenience features, vehicle lighting, vehicle controls, hybrid vehicle battery thermal management, electric vehicle thermal management.

Specification

Attribute Value
Thermal Conductivity 2.7W/m·K
Material Silicone
Maximum Operating Temperature +300°C
Minimum Operating Temperature -30°C
Pack Size 20g
Operating Temperature Range -30 → +300 °C
Physical State Paste
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