THERMAL PASTE
thermal conductivity,
easy to assemble,
high stability,
does not harden with time.
Applications
Displays, lighting protection. PDP TV, LCD CCFL and LCD LED display backlight, LED signage, projectors and new display technology.
Consumer and industrial electronics
Mobile telephone, communication base station, laptop, notebook, computer servers, handheld gaming devices, memory modules, CPU modules, amplifiers, batteries, and DC to DC converter power supplies.
Automotive electronics
Engine management, electronic suspension, braking systems, communication and multimedia systems, comfort convenience features, vehicle lighting, vehicle controls, hybrid vehicle battery thermal management, electric vehicle thermal management.
Specification
Attribute | Value |
Thermal Conductivity | 2.7W/m·K |
Material | Silicone |
Maximum Operating Temperature | +300°C |
Minimum Operating Temperature | -30°C |
Pack Size | 20g |
Operating Temperature Range | -30 → +300 °C |
Physical State | Paste |
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